Fabricating high-density microarrays for retinal recording
Identifieur interne : 00D562 ( Main/Repository ); précédent : 00D561; suivant : 00D563Fabricating high-density microarrays for retinal recording
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Abstract
Understanding how the retina encodes the visual scene is a problem, which requires large area, high-density microelectrode arrays to solve. The correlated signals that emerge from the output (ganglion) cells of the retina form a code, which is not well understood. We use a combination of electron beam lithography, photolithography and dry-etch pattern transfer to realise a 519-electrode array in the transparent conductor indium tin oxide (ITO). The electrodes are spaced at 60 μm in a hexagonal close-packed geometry. A mix and match lithography procedure is utilised, whereby the high-density inner region is fabricated using electron beam lithography whilst the outer sections are realised by photolithography. Reactive ion etching (RIE), using CH4/H2, of the ITO forms the array structure and SF6 RIE allows resist removal and patterning of vias through a plasma deposited Si3N4 protective layer. The electrical properties of the ITO layer are unaffected by the etching procedures. A reliable method for achieving low-impedance electroplated platinum electrodes has been employed to yield electrode impedances of ∼20 kΩ. An array fabricated using these dry-etch techniques is shown to record action potentials from live retinal tissue in neurophysiological experiments.
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<term>ITO layers</term>
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<term>Microelectrode</term>
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<front><div type="abstract" xml:lang="en">Understanding how the retina encodes the visual scene is a problem, which requires large area, high-density microelectrode arrays to solve. The correlated signals that emerge from the output (ganglion) cells of the retina form a code, which is not well understood. We use a combination of electron beam lithography, photolithography and dry-etch pattern transfer to realise a 519-electrode array in the transparent conductor indium tin oxide (ITO). The electrodes are spaced at 60 μm in a hexagonal close-packed geometry. A mix and match lithography procedure is utilised, whereby the high-density inner region is fabricated using electron beam lithography whilst the outer sections are realised by photolithography. Reactive ion etching (RIE), using CH<sub>4</sub>
/H<sub>2</sub>
, of the ITO forms the array structure and SF<sub>6</sub>
RIE allows resist removal and patterning of vias through a plasma deposited Si<sub>3</sub>
N<sub>4</sub>
protective layer. The electrical properties of the ITO layer are unaffected by the etching procedures. A reliable method for achieving low-impedance electroplated platinum electrodes has been employed to yield electrode impedances of ∼20 kΩ. An array fabricated using these dry-etch techniques is shown to record action potentials from live retinal tissue in neurophysiological experiments.</div>
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/H<sub>2</sub>
, of the ITO forms the array structure and SF<sub>6</sub>
RIE allows resist removal and patterning of vias through a plasma deposited Si<sub>3</sub>
N<sub>4</sub>
protective layer. The electrical properties of the ITO layer are unaffected by the etching procedures. A reliable method for achieving low-impedance electroplated platinum electrodes has been employed to yield electrode impedances of ∼20 kΩ. An array fabricated using these dry-etch techniques is shown to record action potentials from live retinal tissue in neurophysiological experiments.</s0>
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